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# Author Citation Select
0. Tsou, J.-Y., Chan Yi Lee, Mak Kwok Pui, Ru Xu Du, Liang Jian, Yeung Kim (2005) Applying Scientific Simulation to Integrate Thermoelectric Conductor Module into Architectural Design Smart Wall for Thermal Comfort

Smart Architecture: Integration of Digital and Building Technologies [Proceedings of the 2005 Annual Conference of the Association for Computer Aided Design In Architecture / ISBN 0-9772832-0-8] Savannah (Georgia) 13-16 October 2005, pp. 200-210 http://papers.cumincad.org/cgi-bin/works/Show?acadia05_200

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