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_id	acadia05_200
id	acadia05_200
authors	Tsou, J.-Y., Chan Yi Lee, Mak Kwok Pui, Ru Xu Du, Liang Jian, Yeung Kim
year	2005
title	Applying Scientific Simulation to Integrate Thermoelectric Conductor Module into Architectural Design – Smart Wall for Thermal Comfort
source	Smart Architecture: Integration of Digital and Building Technologies [Proceedings of the 2005 Annual Conference of the Association for Computer Aided Design In Architecture / ISBN 0-9772832-0-8] Savannah (Georgia) 13-16 October 2005, pp. 200-210
doi	https://doi.org/10.52842/conf.acadia.2005.200
summary	This paper presents the innovative architectural design concept, which is to integrate the new material and technology into the building design to achieve the thermal comfort and at the same time reduce the energy consumption of the building by making use of the renewable energy, including solar and wind energy. The system is developed based on the idea of regional thermal comfort in building. The advantage of the system is the environmental friendly approach, costless operation, reliability, flexibility, scalability and adaptability for the integration to the building design. With the design concept, we tried to do two application designs in two virtual sites. One is a badminton court for the 2008 Beijing Olympic Games and the other is a cooling pond in a shopping mall. We will introduce how computational simulation can contribute to the prediction of the performance of the design. We will also discuss how the computation simulation can help in the design optimization process. Through the development of the new design integration of the material to the building, we would like to feedback to the material industry to encourage further collaboration and development in the material enhancement, so that both industries and the society can benefit from the advancement.
series	ACADIA
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last changed	2022/06/07 07:57

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